The compact laser system is based on the PIRANHA III and equipped with a reversible rotary table. This way, the system can be loaded while workpieces are processed inside the machine. Due to the integrated light barrier, the user is protected against accidentally reaching into the machine because the rotary table stops immediately when the light barrier is interrupted.
A side door with a safety switch allows the user easy handling of the manually adjustable galvo head. The manually swiveling galvo head allows the horizontal and vertical laser machining of workpieces, thereby broadening the system´s range of machinable workpieces.
An integrated collision detector prevents damage to the laser system due to any incorrect operation.
The company´s in-house database connection and a barcode scanner at the machine allows the quick and easy detection of order details and is responsible for the software-related programming of the system.
Company in-house database connection
The company´s in-house database connection combined with, for example, a hand-held scanner for barcodes or DataMatrix codes, allows the quick and easy detection of order details directly at the laser workstation.
The AC-LASER Software Suite can be configured and programmed according to customer requirements. The AC-LASER offers customized layout programming and sequence programming and also customer-programmable user interfaces to ensure quick and creative working.
PIRANHA® rotary table solution
Your application
Your requirement is what
motivates us.
According to this motto,
we are taking on your
challenge and work
together with you in
order to find the
best possible
solution for
your application
requirements.
Options
For every need
We can offer you machine extensions
using different
options provided by
ACSYS in order
to configure the
perfect
production
equipment
for your
specific requirements.
ACSYS software
For optimal processes
Discover the new
dimensions of laser processing.
The AC-LASER
Software Suite
is the ideal
software package
for the machining
of material using the laser.