LASER CUTTING
Ceramic:
The outstanding resistance to high temperatures of ceramic materials combined with customised magnetic, thermal, or optical and other features has led to increased use of ceramic parts in many areas of modern technology in the last decade. However, machining brittle ceramic parts is problematic and tedious.
The laser is predestined to cut ceramic.
Tungsten:
Tungsten is an extremely hard metal with high tensile strength and an extremely high melting point.
With argon as welding gas, good results are possible
at high speeds.
Silicon:
Silicon is used in a wide range of industries, especially in the semiconductor industry and solar technology. In both cases a clean edge with no micro cracks or splinters is an absolute must. Traditionally, silicon has been cut with diamond saws in complicated processes. The problem is that only straight lines can be cut. Furthermore, tiny chips and dust are created and must be removed.
Fibre laser technology opens up completely new possibilities in this area.
Burr-free edges are produced without a trace of
splinters or dust.
Kapton foil (polyimide):
Lasers are extraordinarily well suited to cutting Kapton foil. Polyimide is a high-performance thermoplastic plastic. Kapton foil has been used
for more than 40 years in electrical engineering
and electronics, mostly in the form of light brown,
semi-transparent foil or for construction parts.
Polyimide foil is also used in medicine for dialysis.
PCD (polycrystalline diamond):
Polycrystalline diamond (PCD) is a product
that has been on the market since the 1970s.
It consists of a composite mass of randomly oriented diamond particles permanently pressed onto a carbide base under high pressure and temperature.
Today the high-performance sandwich material is produced under high temperatures and pressure in round plates up to about 4 inches in diameter and in various thicknesses from 0.8 to about 5.0 mm.
The layer of PCD usually accounts for less than
half the total thickness.
Depending on whether they will be used as cutting, milling or broaching tools, the round plates must
be separated into customer-specific shapes of different dimension.
The outstanding beam quality of laser with short pulses and high pulse output provide the best cutting and machining quality for this application.